From raw 4D-STEM datasets to publication-ready atomic structures — our team handles the full analytical pipeline so you can focus on the science. No lab queue, no instrument downtime.
Full ptychographic reconstruction with multislice propagation, including phase retrieval, probe recovery, and depth-sectioning for thick specimens.
Atomic-column position mapping, strain tensor extraction, displacement field visualization, and octahedral tilt quantification with sub-picometer precision.
Multislice image simulation, structure model validation, and DFT-EM joint analysis to confirm experimental interpretations with theoretical ground truth.
Publication-grade figure preparation, 3D atomic structure rendering, and comprehensive analytical reports with full methodology documentation.
On-demand TEM data analysis for semiconductor failure analysis — defect characterization, interface analysis, and process-induced strain evaluation at the atomic scale.
Customized workshops on MEP theory, 4D-STEM experimental design, and data analysis workflows for your research group or FA team.
Transparent, efficient, and collaborative — from first contact to final delivery. No lab queue, no shipping delays.
Share your 4D-STEM dataset via secure cloud link. We evaluate data quality and define analysis scope within 24 hours.
Receive a detailed plan with timeline, pricing, and deliverables. No charge if the proposal doesn't meet your needs.
Our team executes reconstruction and quantitative analysis on GPU clusters. Progress updates every 48 hours.
Live walkthrough of results, followed by delivery of figures, source data, and methodology documentation.
We don't replace third-party labs — we unlock capabilities they cannot provide. Here's the side-by-side comparison.
| Capability | 3datomic | Conventional Lab |
|---|---|---|
| Spatial Resolution | Sub-picometer (atomic column) | Nanometer to sub-nanometer |
| Specimen Thickness | >100 nm (MEP multislice) | <30 nm (conventional TEM) |
| Analysis Mode | Software + Remote data service | Physical lab + Sample shipping |
| Turnaround Time | Hours to days (GPU parallel) | Days to weeks (lab queue) |
| Quantitative Output | Strain tensor, displacement field, polarization map | Morphology, EDS mapping, failure location |
| Data Format | 4D-STEM / Ptychography native | SEM / TEM / FIB / EDS / EELS |
| Use Case Focus | Atomic-scale defect physics, interface structure, phase transitions | Yield improvement, FA root-cause, reliability testing |
| Cost Model | Software license + Per-dataset service | Per-sample testing fee (~$1.5K–4.5K/case) |
| Best For | Research groups, advanced-node FA, DFT-EM validation | Production FA, material qualification, reliability certification |