USE CASES

Where 3datomic Shines

Real-world scenarios where conventional labs reach their limits and MEP delivers breakthrough insights.

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3D-IC TSV Interface Analysis

Conventional TEM cannot handle >50 nm thick TSV cross-sections. MEP reconstructs 100+ nm Cu/SiO₂ interfaces at atomic resolution, revealing diffusion barriers and void formation.

3D-IC TSV Hybrid Bonding
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GAA / CFET Channel Strain Mapping

Sub-picometer strain tensors across nanosheet stacks. Quantify process-induced strain in 2nm-class devices — critical for mobility engineering and threshold voltage tuning.

GAA CFET 2nm Node
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Ferroelectric Domain Topology

Map polarization vortices, skyrmions, and flux-closure domains in HfO₂-based ferroelectrics. Direct observation of atomic displacements enables predictive device modeling.

FeFET HfO₂ Memory
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Solid-State Battery Interface

Atomic-resolution observation of Li-ion migration paths across solid-electrolyte / cathode interfaces. Identify dendrite nucleation sites and grain boundary defects in LLZO/LCO stacks.

Solid-State Li-ion Energy
RECONSTRUCTION RESULTS

See the Difference, Atom by Atom

Real MEP reconstructions from our founding team's published and collaborative research — the same engine that powers our software and services.

ADF-STEM vs MEP reconstruction comparison
MEP reconstruction of point defects in boron carbide

Point Defects in B₄C

Individual point defects resolved atom by atom — C-B-C vs C-V-C chain configurations distinguished directly in the reconstruction, validated against multislice simulation.

S. Ning et al., Science Advances 11, eadr4648 (2025)

Layer-resolved MEP reconstruction of twisted SrTiO3 bilayer

Twisted SrTiO₃ Bilayer

Layer-resolved reconstruction of a 5 nm + 5 nm twisted stack: upper and lower lattices and the moiré interface separated along the beam direction — impossible with projection imaging.

Founding team research, Univ. of Tokyo

Depth-sectioned MEP reconstruction of Al2O3 grain boundary

Depth-Sectioned Grain Boundary

Lu-doped Al₂O₃ Σ13 grain boundary imaged slice by slice from 0 to 36 nm depth — revealing a lateral boundary shift invisible to any 2D technique.

Founding team research, Univ. of Tokyo

Results shown are from peer-reviewed publications and collaborative research by our founding team.